izmomicro, a specialised division of izmo Ltd., has announced a major breakthrough in silicon photonics packaging, strengthening India’s position in the global semiconductor ecosystem and advancing infrastructure for next-generation data and AI applications.

The company has developed a high-density silicon photonics packaging platform that supports 32-channel fibre input and output with an industry-leading insertion loss of less than 2 dB. Achieving this density is among the toughest challenges in the field, requiring nanometre-scale optical alignment, advanced assembly processes, and seamless electronic integration. The module further incorporates 32 DC I/Os, four RF I/Os, and high-speed RF performance up to 70 GHz, setting a new benchmark in photonic-electronic integration.

This achievement reflects izmomicro’s sustained investment in R&D and deep expertise in advanced semiconductor packaging. By addressing critical density and precision barriers, the company joins a select group worldwide capable of delivering this technology.

High-density integration with ultra-low signal loss is vital for the evolution of AI, cloud computing, and telecommunications. As copper interconnects reach their physical limits, silicon photonics is emerging as the enabling technology for multi-terabit optical communication. izmomicro’s innovation helps overcome packaging constraints, unlocking scalability and efficiency for hyperscale data centres, AI clusters, and next-generation 5G/6G networks.

Dinanath Soni, Executive Director of izmomicro, said:

“Achieving this level of fibre density with ultra-low insertion loss is a defining moment for izmomicro. Only a handful of companies worldwide have demonstrated this capability, and we are proud to be the first in India. This validates our years of R&D and positions us as a critical partner for the global silicon photonics industry.”