TRUMPF showcased how its laser and plasma technologies can reduce manufacturing costs and improve chip quality at Semicon Japan 2025. The high-tech company highlighted innovations designed to support the rapidly growing semiconductor industry, which is balancing efficiency, precision and sustainability, particularly for next-generation chips used in AI applications.

A key focus was TRUMPF’s combined laser etching process for advanced packaging using glass instead of silicon. Glass interposers are significantly cheaper and enable cost-effective, high-speed chip production. TRUMPF’s ultrashort pulse laser selectively modifies glass structures, followed by precisely coordinated etching to create through-glass vias (TGVs). This process has already been validated in collaboration with SCHMID Group. The solution is further enhanced by TRUMPF’s HiPIMS technology, which delivers highly uniform and dense copper coatings, critical for high-aspect-ratio vias in advanced packaging.

TRUMPF also introduced the new TruPlasma RF Series G3, which enables more stable plasma processes through real-time monitoring and energy adjustment. The system improves layer consistency, reduces power consumption by 20 per cent, and supports flexible integration into existing manufacturing lines. Together, these technologies position TRUMPF as a key enabler of cost-efficient, high-performance semiconductor production.