NITI Aayog Releases 10 Year Roadmap For Semiconductor Industry
The document targets building a USD 120-150 billion (bn) semiconductor value chain by 2035 and anchors the plan in India's strengths in design talent, innovation capability and manufacturing. It is organised around five pillars: pioneering frontier research and development and design intellectual property; policy and investment to mobilise long-horizon capital; production focused on advanced packaging and compound semiconductors; people across the full semiconductor talent pyramid; and partnerships with trusted nations and global industry. The roadmap identifies advanced packaging and outsourced semiconductor assembly and test as priority areas. It also emphasises wide-bandgap and compound semiconductor supply for strategic applications.
The plan sets goals to position India as a leading destination for advanced packaging, to scale compound semiconductor manufacturing and to strengthen frontier design capabilities. It envisages the creation of more than 100 advanced semiconductor design IPs and aligns with priorities announced under the India Semiconductor Mission 2.0 in the Union Budget 2026. The emphasis moves the policy stance from attracting foundational investments to deepening ecosystem capabilities across design, materials, manufacturing, packaging, talent and research and development.
The roadmap is presented as a long-horizon initiative requiring sustained commitment across government, industry and academia to realise technological sovereignty and strategic autonomy. Officials indicated that the initiative is central to the broader Viksit Bharat 2047 vision and is intended to reduce dependence on external technology control. The full roadmap has been published on the NITI Aayog Frontier Tech Hub website for stakeholders and investors to consult.