India and Singapore sign semiconductors and digital cooperation pacts
ECONOMY & POLICY

India and Singapore sign semiconductors and digital cooperation pacts

India and Singapore have signed a significant bilateral agreement to collaborate in the semiconductor industry, aiming to boost India’s growing semiconductor sector while facilitating the entry of Singaporean companies into the Indian market. This development took place during Prime Minister Narendra Modi's two-day visit to Singapore, where both nations agreed to strengthen their relationship to a ‘Comprehensive Strategic Partnership’ ahead of the 60th anniversary of diplomatic ties next year. As part of the visit, several MoUs were signed, covering areas like semiconductors, digital cooperation, education, skills development, and healthcare. PM Modi, alongside Singaporean Prime Minister Lawrence Wong, visited AEM Holdings Ltd's semiconductor facility, where they were briefed by the Singapore Semiconductor Industry Association.

Singapore, known for its expertise in producing low-end chips essential for electric vehicles and smartphones, has a semiconductor industry that constitutes 7-8% of its GDP and contributes 10% to global semiconductor output. The collaboration will support India’s aim to establish itself as a global semiconductor manufacturing hub, particularly in sectors like electronics and electric vehicles.

The digital cooperation pact focuses on governance frameworks for data protection, enabling secure data flows and cooperation between cybersecurity agencies in both countries. Additionally, both leaders discussed enhancing partnerships in sustainability, green hydrogen, green ammonia, and emerging critical technologies.

Singapore is India's sixth-largest trading partner, with bilateral trade worth $35.3 billion. PM Modi also held meetings with key business leaders from major firms such as Blackstone Singapore, Temasek Holdings, and Singapore Airlines.

(business standard)

India and Singapore have signed a significant bilateral agreement to collaborate in the semiconductor industry, aiming to boost India’s growing semiconductor sector while facilitating the entry of Singaporean companies into the Indian market. This development took place during Prime Minister Narendra Modi's two-day visit to Singapore, where both nations agreed to strengthen their relationship to a ‘Comprehensive Strategic Partnership’ ahead of the 60th anniversary of diplomatic ties next year. As part of the visit, several MoUs were signed, covering areas like semiconductors, digital cooperation, education, skills development, and healthcare. PM Modi, alongside Singaporean Prime Minister Lawrence Wong, visited AEM Holdings Ltd's semiconductor facility, where they were briefed by the Singapore Semiconductor Industry Association. Singapore, known for its expertise in producing low-end chips essential for electric vehicles and smartphones, has a semiconductor industry that constitutes 7-8% of its GDP and contributes 10% to global semiconductor output. The collaboration will support India’s aim to establish itself as a global semiconductor manufacturing hub, particularly in sectors like electronics and electric vehicles. The digital cooperation pact focuses on governance frameworks for data protection, enabling secure data flows and cooperation between cybersecurity agencies in both countries. Additionally, both leaders discussed enhancing partnerships in sustainability, green hydrogen, green ammonia, and emerging critical technologies. Singapore is India's sixth-largest trading partner, with bilateral trade worth $35.3 billion. PM Modi also held meetings with key business leaders from major firms such as Blackstone Singapore, Temasek Holdings, and Singapore Airlines. (business standard)

Next Story
Infrastructure Transport

Kavach 4.0 Commissioned on Delhi–Mumbai and Delhi–Howrah

"Kavach version four has been commissioned on 1,452 route km, covering the high density Delhi–Mumbai and Delhi–Howrah corridors. The rollout included laying 8,570 km of optical fibre, installation of 1,100 telecom towers, deployment of trackside equipment over 6,776 RKm and establishment of 767 station data centres. Trackside implementation has been taken up on 24,427 RKm covering Golden Quadrilateral, Golden Diagonal and High Density Network sections. The programme aims to strengthen signalling and train protection on key routes.Kavach is an indigenously developed automatic train protecti..

Next Story
Infrastructure Transport

Railways Advance Kalyan–Murbad Line And Mumbai Capacity Expansion

"Indian Railways is advancing multiple rail infrastructure projects in Maharashtra, including the sanctioned Kalyan–Murbad new line and sizable investments under the Mumbai Urban Transport Project and the Mumbai–Ahmedabad High Speed Rail project. The Kalyan–Murbad 28 km new line has been sanctioned at Rs 8.36 billion (bn) on a 50:50 cost-sharing basis with the Government of Maharashtra and has been declared a Special Railway Project for land acquisition; proposals covering 214 hectares are at various stages of acquisition. Budgetary outlay for projects falling fully or partly in Maharash..

Next Story
Infrastructure Urban

Parliamentary Panel Flags Funding Gaps in Heavy Industries

"The Department-Related Parliamentary Standing Committee on Industry (Rajya Sabha) presented its 332nd report on the Demands for Grants 2026-27 of the Ministry of Heavy Industries (MHI). Figures converted from crore and lakh are expressed in million (mn). The Budget Estimates 2026-27 for the Ministry stand at Rs 79,399 mn against a projected requirement of Rs 94,843.2 mn, a shortfall of about 16 per cent, with revenue at Rs 79,370.8 mn and capital compressed to Rs 28.2 mn from Rs 5,020 mn.The committee flagged recurring BE-to-RE compression and declining revised estimate utilisation, and calle..

Advertisement

Subscribe to Our Newsletter

Get daily newsletters around different themes from Construction world.

STAY CONNECTED

Advertisement

Advertisement

Advertisement