TRUMPF Showcases Cost-Saving Chip Tech at Semicon Japan

22 Dec 2025 CW Team

TRUMPF showcased how its laser and plasma technologies can reduce manufacturing costs and improve chip quality at Semicon Japan 2025. The high-tech company highlighted innovations designed to support the rapidly growing semiconductor industry, which is balancing efficiency, precision and sustainability, particularly for next-generation chips used in AI applications.

A key focus was TRUMPF’s combined laser etching process for advanced packaging using glass instead of silicon. Glass interposers are significantly cheaper and enable cost-effective, high-speed chip production. TRUMPF’s ultrashort pulse laser selectively modifies glass structures, followed by precisely coordinated etching to create through-glass vias (TGVs). This process has already been validated in collaboration with SCHMID Group. The solution is further enhanced by TRUMPF’s HiPIMS technology, which delivers highly uniform and dense copper coatings, critical for high-aspect-ratio vias in advanced packaging.

TRUMPF also introduced the new TruPlasma RF Series G3, which enables more stable plasma processes through real-time monitoring and energy adjustment. The system improves layer consistency, reduces power consumption by 20 per cent, and supports flexible integration into existing manufacturing lines. Together, these technologies position TRUMPF as a key enabler of cost-efficient, high-performance semiconductor production.

Infrastructure Transport

06 Feb 2026

Second Mountain Tunnel Breakthrough in Palghar Advances High Speed Rail

The Mumbai-Ahmedabad high speed rail (MAHSR) project reached a milestone with the breakthrough of a mountain tunnel in Palghar, Maharashtra. Mountain tunnel MT-six measures 454 metres long and 14.4 metres wide and will accommodate up and down tracks. The breakthrough follows MT-five near Saphale on second January 2026 and the MT-six excavation was completed from both ends using the New Austrian Tunnelling Method. The ministry reported that the tunnelling was completed within 12 months. The New Austrian Tunnelling Method is favoured for its flexibility in complex geology and irregular tunnel s..

Modi Government Pushes Atmanirbhar Container Drive With BCSL MoU

The Union Government advanced a plan to create an integrated, domestically anchored container ecosystem with the signing of a Memorandum of Understanding to establish the Bharat Container Shipping Line (BCSL). The MoU was signed by key agencies including the Shipping Corporation of India and Container Corporation of India alongside major port authorities and Sagarmala Finance Corporation Limited under the Ministry of Ports, Shipping and Waterways, in the presence of senior ministers. The initiative aligns with the Container Manufacturing Assistance Scheme announced in the Union Budget 2026–2..

Ministry Reports Gains In Mobility For Marginalised Communities

The Ministry of Social Justice and Empowerment is implementing skill development, education and rehabilitation schemes to promote socio-economic mobility and sustainable livelihoods for marginalised and disadvantaged communities across the country. Programmes target Scheduled Castes, Other Backward Classes, Economically Weaker Sections, De-notified Tribes and Safai Karamcharis through specialised implementing corporations and empanelled training institutes. Pradhan Mantri Dakshata Aur Kushalta Sampann Hitgrahi Yojana, or PM-DAKSH, provided skill training and placement support through the Nati..