Foundation Stone Laid For First Three-Dimensional Chip Unit In Odisha

23 Apr 2026 CW Team

He indicated that the facility will use advanced three-dimensional glass substrate technology in chip manufacturing, described as a next-generation innovation in the semiconductor sector, and that the plant will be based on advanced technology rather than traditional silicon substrates. He also said authorities will pursue steps to double capacity after completion of the first phase and that several railway redevelopment projects in the state are under way to improve logistics and connectivity.

The Odisha chief minister characterised the project as a historic milestone for the state and the nation and added that global technology leaders such as Intel, Lockheed Martin and Applied Materials are associated with cutting-edge packaging technologies and have shown interest in the location. The company is reported to be investing Rs 20 billion (bn) in the first phase. The facility is expected to produce 70,000 glass panels annually, deliver 50 million (mn) assembled units and manufacture around 13,000 advanced 3DHI modules.

Officials said the project will create employment for more than 2,500 people and noted that Odisha has become the only state where both the country's first compound semiconductor fabrication unit and the first three-dimensional glass substrate packaging facility are being established. Observers view the development as likely to bolster high-end electronics manufacturing capacity in the region and to strengthen the domestic supply chain for semiconductors.

The foundation stone for the country's first advanced three-dimensional chip packaging unit was laid at Info Valley in Bhubaneswar on April nineteen, marking a significant step towards strengthening India's domestic semiconductor ecosystem and advancing the vision of Atmanirbhar Bharat in high-end electronics manufacturing. Union Minister for Electronics and IT Ashwini Vaishnaw noted that the ceremony coincided with Akshay Tritiya and expressed gratitude to the Prime Minister and the Odisha chief minister. He indicated that the facility will use advanced three-dimensional glass substrate technology in chip manufacturing, described as a next-generation innovation in the semiconductor sector, and that the plant will be based on advanced technology rather than traditional silicon substrates. He also said authorities will pursue steps to double capacity after completion of the first phase and that several railway redevelopment projects in the state are under way to improve logistics and connectivity. The Odisha chief minister characterised the project as a historic milestone for the state and the nation and added that global technology leaders such as Intel, Lockheed Martin and Applied Materials are associated with cutting-edge packaging technologies and have shown interest in the location. The company is reported to be investing Rs 20 billion (bn) in the first phase. The facility is expected to produce 70,000 glass panels annually, deliver 50 million (mn) assembled units and manufacture around 13,000 advanced 3DHI modules. Officials said the project will create employment for more than 2,500 people and noted that Odisha has become the only state where both the country's first compound semiconductor fabrication unit and the first three-dimensional glass substrate packaging facility are being established. Observers view the development as likely to bolster high-end electronics manufacturing capacity in the region and to strengthen the domestic supply chain for semiconductors.

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