Union Minister for Electronics and IT Ashwini Vaishnaw has announced the approval of the first tranche of seven projects under the Electronics Components Manufacturing Scheme (ECMS), marking a major step in India’s transition from assembling finished goods to manufacturing the modules, components, materials, and machinery that power them. The approved projects will enable domestic production of multi-layer and high-density PCBs, camera modules, copper clad laminates, and polypropylene films, significantly advancing India’s self-reliance in electronics manufacturing. Strong global response to ECMS The ECMS has attracted an overwhelming response from both domestic and international firms, receiving 249 applications representing a total proposed investment of Rs 1.15 trillion (Rs 1,15,000 crore / USD 13.8 billion), potential production worth Rs 10.34 trillion (Rs 10,34,000 crore / USD 124 billion), and 142,000 new jobs. This marks the highest-ever investment commitment in India’s electronics manufacturing sector. The seven newly approved projects, with a combined investment of Rs 55.32 billion (USD 664 million), are expected to generate Rs 365.59 billion (USD 4.4 billion) worth of components and create over 5,100 direct jobs. The approved units are located in Tamil Nadu (5 units), Andhra Pradesh (1 unit), and Madhya Pradesh (1 unit) — underscoring the government’s focus on balanced regional growth and expansion of high-tech industries beyond major urban centres. Boosting domestic production Minister Vaishnaw stated that 20 per cent of India’s domestic demand for printed circuit boards (PCBs) and 15 per cent of camera module sub-assemblies will be met through the production from these new facilities. Additionally, domestic production of copper clad laminates will now fully meet local demand, while around 60 per cent of output from these plants will be exported. The projects encompass key components critical to modern electronics — High-Density Interconnect (HDI) and Multi-Layer PCBs, camera modules, copper clad laminates, and polypropylene films. Expanding India’s electronics ecosystem Camera modules, which serve as compact imaging systems used in smartphones, drones, laptops, tablets, robotics, medical instruments, and automotive systems, will now be produced domestically. The HDI and Multi-Layer PCBs, essential circuit boards that control and connect all electronic devices, will be manufactured locally for use across consumer electronics, automotive, and industrial applications. In a first, India will also set up a Copper Clad Laminate (CCL) production facility, a crucial base material for multi-layer PCBs that was previously imported. Similarly, polypropylene films, used in capacitor manufacturing for electronics, automotive, ICT, telecommunications, and industrial equipment, will now be produced in India. Economic and industrial impact The ECMS projects are expected to: Reduce import dependence and lower domestic product costs Create high-skill jobs in manufacturing and R&D Build trusted supply chains for defence, telecom, EVs, and renewable energy sectors This initiative complements India’s Production Linked Incentive (PLI) scheme and the India Semiconductor Mission (ISM), completing a seamless value chain — from devices to chips, components to materials, and manufacturing to innovation.