Odisha Lays Foundation For India’s First Advanced 3D Packaging Unit

21 Apr 2026 CW Team

State leaders described the initiative as a historic milestone that will support sectors such as artificial intelligence, high-performance computing, defence electronics and telecommunications. The company is investing nearly Rs 20 billion (bn) in the project, with total investment recorded at Rs 19.44 bn including approved central fiscal support of Rs 7.99 bn and additional state support of about Rs 3.995 bn. The facility is planned to produce 70,000 glass panels annually, 50 million (mn) assembled units and around 13,000 advanced 3DHI modules.

Officials said the new unit will strengthen the domestic semiconductor value chain and drive Odisha’s transition from a resource-based economy to a technology-led growth centre, creating employment for engineering graduates, diploma holders and ITI students. The government indicated that commercial production is expected to begin by August 2028 and full-scale volume production is targeted by August 2030. Ministers highlighted Odisha’s emergence as a fast-growing IT and semiconductor hub with two projects approved under the India Semiconductor Mission and further proposals under consideration.

Union authorities also outlined concurrent infrastructure plans, noting projects worth over Rs 900 bn in execution and a record railway allocation of Rs 109.28 bn to enhance connectivity and support economic expansion across the state. The expansion of station redevelopment and the planned coastal four-line rail corridor were presented as measures to integrate Odisha with national freight and passenger networks. Officials said the combined push in electronics, skills development and transport infrastructure will position Odisha as a strategic centre for future technologies.

In a defining move for India’s semiconductor ambitions, the foundation stone for the country’s first advanced 3D chip packaging unit was laid at Info Valley, Bhubaneswar. The project, Heterogeneous Integration Packaging Solutions promoted by 3D Glass Solutions, will establish a greenfield, vertically integrated advanced packaging and embedded glass substrate ATMP facility through its Indian subsidiary Heterogeneous Integration Packaging Solutions Pvt. Ltd. The ceremony was attended by Chief Minister Mohan Charan Majhi and Union Minister Ashwini Vaishnaw alongside senior officials. State leaders described the initiative as a historic milestone that will support sectors such as artificial intelligence, high-performance computing, defence electronics and telecommunications. The company is investing nearly Rs 20 billion (bn) in the project, with total investment recorded at Rs 19.44 bn including approved central fiscal support of Rs 7.99 bn and additional state support of about Rs 3.995 bn. The facility is planned to produce 70,000 glass panels annually, 50 million (mn) assembled units and around 13,000 advanced 3DHI modules. Officials said the new unit will strengthen the domestic semiconductor value chain and drive Odisha’s transition from a resource-based economy to a technology-led growth centre, creating employment for engineering graduates, diploma holders and ITI students. The government indicated that commercial production is expected to begin by August 2028 and full-scale volume production is targeted by August 2030. Ministers highlighted Odisha’s emergence as a fast-growing IT and semiconductor hub with two projects approved under the India Semiconductor Mission and further proposals under consideration. Union authorities also outlined concurrent infrastructure plans, noting projects worth over Rs 900 bn in execution and a record railway allocation of Rs 109.28 bn to enhance connectivity and support economic expansion across the state. The expansion of station redevelopment and the planned coastal four-line rail corridor were presented as measures to integrate Odisha with national freight and passenger networks. Officials said the combined push in electronics, skills development and transport infrastructure will position Odisha as a strategic centre for future technologies.

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