India’s Semiconductor Push with Rs 760.00 billion
Technology

India’s Semiconductor Push with Rs 760.00 billion

The Indian government is accelerating semiconductor manufacturing, research, and skill development under the Semicon India Programme with an outlay of Rs 760.00 billion. It provides 51 per cent fiscal support for projects related to chip fabrication, display fabs, compound semiconductors, and semiconductor assembly (ATMP/OSAT). Product Design Linked Incentives further support chip design.

Key initiatives: - Rs 1520.00 billion investment in five semiconductor manufacturing projects (1 fabrication, 4 ATMP/OSAT).

- MoUs with USA, EU, Japan, and Singapore to boost semiconductor collaboration.

- Skill Development Initiatives:

- AICTE introduced new VLSI and IC manufacturing curricula.

- Chips to Startup (C2S) Programme aims to train 85,000 engineers in VLSI and embedded systems.

- SMART Lab at NIELIT Calicut targets 0.1 million engineers in five years, training 42,000+ so far.

- MoUs for talent development with IISc & Lam Research (60,000 engineers in 10 years), IBM, and Purdue University.

The government is also modernising the Semi-Conductor Laboratory (Mohali) and funding R&D in chip design, nanotechnology, and semiconductor processes to enhance India’s self-reliance in semiconductor technology.

The Indian government is accelerating semiconductor manufacturing, research, and skill development under the Semicon India Programme with an outlay of Rs 760.00 billion. It provides 51 per cent fiscal support for projects related to chip fabrication, display fabs, compound semiconductors, and semiconductor assembly (ATMP/OSAT). Product Design Linked Incentives further support chip design. Key initiatives: - Rs 1520.00 billion investment in five semiconductor manufacturing projects (1 fabrication, 4 ATMP/OSAT). - MoUs with USA, EU, Japan, and Singapore to boost semiconductor collaboration. - Skill Development Initiatives: - AICTE introduced new VLSI and IC manufacturing curricula. - Chips to Startup (C2S) Programme aims to train 85,000 engineers in VLSI and embedded systems. - SMART Lab at NIELIT Calicut targets 0.1 million engineers in five years, training 42,000+ so far. - MoUs for talent development with IISc & Lam Research (60,000 engineers in 10 years), IBM, and Purdue University. The government is also modernising the Semi-Conductor Laboratory (Mohali) and funding R&D in chip design, nanotechnology, and semiconductor processes to enhance India’s self-reliance in semiconductor technology.

Next Story
Resources

Jyoti Structures Launches Heat Safety Drive Across Sites

Jyoti Structures (JSL) has strengthened heat safety measures across its project sites and manufacturing facilities as temperatures rise across India. The company has implemented a Summer Safety Plan covering all transmission line projects to address risks related to heat stress, dehydration and worker fatigue.The initiative includes rescheduling work away from peak afternoon temperatures, provision of drinking water, ORS and lemon-salt solutions, and installation of rest shelters near work areas. Daily toolbox talks, worker health monitoring, first-aid preparedness, emergency transport arrange..

Next Story
Real Estate

MHADA Declares 82 Buildings Most Dangerous in Central and South Mumbai

The Maharashtra Housing and Area Development Authority (MHADA) has declared 82 buildings as most dangerous across Central and South Mumbai and has appealed to residents to vacate immediately. The list, prepared after structural assessments by the authority, identifies buildings judged to pose imminent risk to occupants and to passersby. Local civic bodies have been asked to coordinate evacuations and to make arrangements for temporary shelter and rehabilitation for displaced households. Officials said the authority prioritised buildings with visible structural distress, severe cracking, tiltin..

Next Story
Infrastructure Transport

Damage Reported At Halwara Airport Terminal After First Rains

Severe damage was reported at the terminal of Halwara Airport during the first major rain spell of the season, prompting immediate concern among aviation and local authorities. Images from the site showed water ingress and visible deterioration of the terminal interior, affecting passenger areas and ancillary services. The airport authority suspended certain operations temporarily to assess structural safety and ensure passenger wellbeing. Preliminary inspections have prioritised electrical systems and roof seals to prevent further water ingress. State aviation officials ordered a formal inqui..

Advertisement

Subscribe to Our Newsletter

Get daily newsletters around different themes from Construction world.

STAY CONNECTED

Advertisement

Advertisement

Advertisement