India Electronics Manufacturing Expands Under PLI Schemes

03 Apr 2026 CW Team

The Production Linked Incentive scheme for Large Scale Electronics Manufacturing (PLI LSEM) began in 2020 to boost domestic mobile phone manufacturing, with 32 beneficiary companies approved. The scheme exceeded its investment target of Rs 7,000 crore by achieving Rs 17,519 crore, equivalent to Rs 175.19 billion (bn). Production targets of Rs 812,550 crore were exceeded by Rs 1,101,813 crore, equivalent to Rs 11.02 trillion (tn), and export targets of Rs 487,530 crore were surpassed with Rs 620,974 crore achieved.

India is now the second largest mobile manufacturer, with mobile phone production rising from Rs 2.14 lakh crore in FY 2019-20 to Rs 5.5 lakh crore in FY 2024-25, equivalent to Rs 2.14 trillion (tn) and Rs 5.5 trillion (tn) respectively. Mobile phone exports rose roughly eightfold from Rs 0.27 lakh crore to Rs 2 lakh crore, and smartphones became India’s top exported commodity in calendar year 2025 with exports of Rs 262,452 crore, equivalent to Rs 2.62 trillion (tn). More than 300 mobile manufacturing units are operational and the sector supports around 1,200,000 direct and indirect jobs.

The PLI scheme 2.0 for IT Hardware recorded cumulative production of Rs 18,863.1 crore and cumulative investment of Rs 872.16 crore, equivalent to Rs 188.63 billion (bn) and Rs 8.72 billion (bn) respectively, with 5,039 direct jobs and Rs 82 crore of incentives disbursed. The Electronics Component Manufacturing Scheme has received commitments of Rs 1.15 lakh crore against a target of Rs 59,350 crore and is estimated to generate about 140,000 jobs; the budgetary outlay was increased to Rs 40,000 crore from Rs 22,919 crore. This information was submitted by the Union Minister of State for Electronics and Information Technology, Shri Jitin Prasad, in the Lok Sabha on one April 2026.

India's electronics manufacturing strategy follows the Prime Minister's vision of AtmaNirbhar Bharat and seeks to make India a global manufacturing hub. The government has pursued a targeted approach to develop the entire value chain from finished products to components, base materials and capital equipment. Over the past 11 years electronics manufacturing has expanded significantly and domestic value addition has improved to 18–20 per cent. Production of electronics goods rose six times and exports increased eight times. The Production Linked Incentive scheme for Large Scale Electronics Manufacturing (PLI LSEM) began in 2020 to boost domestic mobile phone manufacturing, with 32 beneficiary companies approved. The scheme exceeded its investment target of Rs 7,000 crore by achieving Rs 17,519 crore, equivalent to Rs 175.19 billion (bn). Production targets of Rs 812,550 crore were exceeded by Rs 1,101,813 crore, equivalent to Rs 11.02 trillion (tn), and export targets of Rs 487,530 crore were surpassed with Rs 620,974 crore achieved. India is now the second largest mobile manufacturer, with mobile phone production rising from Rs 2.14 lakh crore in FY 2019-20 to Rs 5.5 lakh crore in FY 2024-25, equivalent to Rs 2.14 trillion (tn) and Rs 5.5 trillion (tn) respectively. Mobile phone exports rose roughly eightfold from Rs 0.27 lakh crore to Rs 2 lakh crore, and smartphones became India’s top exported commodity in calendar year 2025 with exports of Rs 262,452 crore, equivalent to Rs 2.62 trillion (tn). More than 300 mobile manufacturing units are operational and the sector supports around 1,200,000 direct and indirect jobs. The PLI scheme 2.0 for IT Hardware recorded cumulative production of Rs 18,863.1 crore and cumulative investment of Rs 872.16 crore, equivalent to Rs 188.63 billion (bn) and Rs 8.72 billion (bn) respectively, with 5,039 direct jobs and Rs 82 crore of incentives disbursed. The Electronics Component Manufacturing Scheme has received commitments of Rs 1.15 lakh crore against a target of Rs 59,350 crore and is estimated to generate about 140,000 jobs; the budgetary outlay was increased to Rs 40,000 crore from Rs 22,919 crore. This information was submitted by the Union Minister of State for Electronics and Information Technology, Shri Jitin Prasad, in the Lok Sabha on one April 2026.

Resources

13 May 2026

Anant Raj Appoints Anish Sarin as Director

Anant Raj has appointed Anish Sarin as Director on its Board, marking a key step in the company’s leadership transition and long-term growth strategy. The announcement was made during the company’s Q4 and FY26 results declaration, reflecting the induction of next-generation leadership as the company expands across real estate, cloud infrastructure and data centre businesses. Anish Sarin, grandson of veteran industrialist Ashok Sarin, represents the emerging leadership at Anant Raj. Educated at Regent’s University London, he brings a global business outlook along with a strong focus on t..

Technology

13 May 2026

Vedanta eyes AI-led value growth

Vedanta Group expects to unlock USD 300–400 million in additional value over the next three years through large-scale deployment of AI-led industrial technologies across its businesses. The group said its V-Spark DeepTech Ventures platform has already delivered nearly four times return on investment since inception.Vedanta is scaling AI, predictive analytics, Industrial Internet of Things, digital twins, machine learning, automation and connected manufacturing technologies across its metals, mining, energy and industrial operations. These deployments are aimed at improving productivity, lowe..

Infrastructure Urban

13 May 2026

Hindustan Zinc inks pact with Group Nirmal

Hindustan Zinc has signed an MoU with Group Nirmal to set up a zinc wire manufacturing facility at its Zinc Industrial Park in Khankhala, Bhilwara district, Rajasthan. The partnership will expand downstream manufacturing activity and support value-added zinc applications in India.Under the agreement, Group Nirmal will manufacture zinc wire products using Hindustan Zinc’s Special High Grade zinc. The products will cater to infrastructure, renewable energy, automotive and industrial engineering sectors.Zinc wire is used in thermal spray coating and metallising processes to protect steel struct..