States Urged to Collaborate on Centre’s Scheme to Boost Electronics Manufacturing

09 Jun 2025 CW Team

Several states, including Tamil Nadu, Assam, Uttar Pradesh and Andhra Pradesh, are developing their own policies to encourage component manufacturing locally. Speaking at an industry event in Andhra Pradesh, Sushil Pal, Joint Secretary at the Ministry of Electronics and Information Technology (MeitY), reiterated the government’s dedication to fostering domestic electronics manufacturing through a hybrid scheme. This scheme offers capital expenditure (Capex) support alongside turnover-linked incentives for component manufacturers.

He urged states to adopt a proactive role in the mission of transforming India into a powerhouse for component manufacturing.

At the event, Bhaskar Katamneni, Secretary of IT & Electronics for Andhra Pradesh, unveiled the draft Electronics Component Manufacturing Policy (ECMP) aimed at boosting electronics component manufacturing in the state.

“We are not only promoting ease of doing business but also enabling the ‘speed of doing business’. Andhra Pradesh is crafting a more competitive and agile policy framework compared to the national landscape,” said Katamneni. He added that the Andhra Pradesh ECMP is expected to be officially notified within the next ten days.

The draft policy includes measures such as 50 per cent Capex support for component manufacturers, turnover-linked incentives that double those provided by the Centre, development of specialised infrastructure and plug-and-play clusters, and facilitation of talent development, skilling and research and development support.

Pankaj Mohindroo, Chairman of ICEA, emphasised that the industry must now actively pursue high domestic value addition and establish a strong, resilient electronics manufacturing supply chain within India.

The event was attended by senior government officials from MeitY and the state government, as well as manufacturers, industry leaders and key stakeholders in the electronics ecosystem.

States must collaborate and leverage the Centre’s scheme to promote domestic manufacturing of electronic components, aiming to position India as a global hub for components production, the India Cellular and Electronics Association (ICEA) said on Friday.Several states, including Tamil Nadu, Assam, Uttar Pradesh and Andhra Pradesh, are developing their own policies to encourage component manufacturing locally. Speaking at an industry event in Andhra Pradesh, Sushil Pal, Joint Secretary at the Ministry of Electronics and Information Technology (MeitY), reiterated the government’s dedication to fostering domestic electronics manufacturing through a hybrid scheme. This scheme offers capital expenditure (Capex) support alongside turnover-linked incentives for component manufacturers.He urged states to adopt a proactive role in the mission of transforming India into a powerhouse for component manufacturing.At the event, Bhaskar Katamneni, Secretary of IT & Electronics for Andhra Pradesh, unveiled the draft Electronics Component Manufacturing Policy (ECMP) aimed at boosting electronics component manufacturing in the state.“We are not only promoting ease of doing business but also enabling the ‘speed of doing business’. Andhra Pradesh is crafting a more competitive and agile policy framework compared to the national landscape,” said Katamneni. He added that the Andhra Pradesh ECMP is expected to be officially notified within the next ten days.The draft policy includes measures such as 50 per cent Capex support for component manufacturers, turnover-linked incentives that double those provided by the Centre, development of specialised infrastructure and plug-and-play clusters, and facilitation of talent development, skilling and research and development support.Pankaj Mohindroo, Chairman of ICEA, emphasised that the industry must now actively pursue high domestic value addition and establish a strong, resilient electronics manufacturing supply chain within India.The event was attended by senior government officials from MeitY and the state government, as well as manufacturers, industry leaders and key stakeholders in the electronics ecosystem.

Technology

29 Jul 2026

AI-Enabled Workflows Lift Profitability and Productivity

Organisations modernising frontline workflows with artificial intelligence, automation and real-time data are reporting stronger financial performance, higher productivity and improved employee engagement, according to a global study by Zebra Technologies and Oxford Economics.The research covered 1,000 senior leaders across retail, manufacturing, transportation and logistics in the US, Mexico, the UK, Germany, India, Japan, Australia and New Zealand.In transportation and logistics, 54 per cent of companies that improved picking and packing operations reported faster operational performance, wh..

Real Estate

29 Jul 2026

India Leads Global AI Readiness but Implementation Lags

Indian companies lead global averages across all eight artificial intelligence readiness indicators tracked by JLL, but only 19 per cent have started making changes to their workplaces, according to the JLL 2026 Future of Work Survey.The study found that 77 per cent of Indian business leaders expect AI to change their office requirements, creating a 58-percentage-point gap between awareness and implementation. The survey covered more than 2,200 CEOs, CFOs and real estate leaders across 21 countries during the first quarter of 2026.Despite concerns over automation, 58 per cent of Indian leaders..

Equipment

29 Jul 2026

Three WOLFF Cranes Build Riyadh Cable-Stayed Bridges

Three WOLFF 180 B luffing jib cranes are supporting the construction of two cable-stayed bridges alongside the existing Wadi Laban Bridge in Riyadh, Saudi Arabia. The project is being developed for the Royal Commission for Riyadh City and executed by the ICRC joint venture comprising IC Ictas and Al Rashid Trading & Contracting Company.The cranes are handling lifting operations including formwork, reinforcement, concrete placement, work platforms, surveying equipment and other construction materials. Each crane is fitted with a 40 m jib, reaches a hook height of 157 m and offers a maximum ..