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Setback: Panel Rejects Ship-Breaking Steel for TMT Bars
Steel

Setback: Panel Rejects Ship-Breaking Steel for TMT Bars

A recent development has seen the Steel Ministry panel dismissing a proposal that sought to incorporate steel plates from ship-breaking into the production of TMT (Thermo-Mechanically Treated) bars. The decision bears implications for the steel sector, impacting the potential utilization of a significant resource stream. The proposal's rejection underscores the ongoing challenges in diversifying raw materials for steel production. Proponents argued for the cost-effectiveness and sustainability of repurposing ship-breaking steel, while opponents emphasized concerns about the structural integrity and quality standards of resulting TMT bars. This decision resonates across the steel industry, affecting manufacturers, suppliers, and stakeholders. The rejection reflects the regulatory body's commitment to stringent quality control and adherence to established standards in the production of construction materials.

A recent development has seen the Steel Ministry panel dismissing a proposal that sought to incorporate steel plates from ship-breaking into the production of TMT (Thermo-Mechanically Treated) bars. The decision bears implications for the steel sector, impacting the potential utilization of a significant resource stream. The proposal's rejection underscores the ongoing challenges in diversifying raw materials for steel production. Proponents argued for the cost-effectiveness and sustainability of repurposing ship-breaking steel, while opponents emphasized concerns about the structural integrity and quality standards of resulting TMT bars. This decision resonates across the steel industry, affecting manufacturers, suppliers, and stakeholders. The rejection reflects the regulatory body's commitment to stringent quality control and adherence to established standards in the production of construction materials.

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Infrastructure Urban

India Expands Semiconductor Training To 500 Institutions

Under the Chips to Startups programme of the India Semiconductor Mission, the Union minister responsible for Railways, Information and Broadcasting, and Electronics and IT reported notable progress in talent development. He indicated that over the past four years substantial steps have been taken towards a 10-year target of training 85,000 engineers in semiconductor design. World-class EDA tools have been deployed in 315 academic institutions across the country to provide students with practical exposure to chip design. These EDA tools are supported by leading global firms and are accessible t..

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Infrastructure Urban

Delhi Institutions Support India Semiconductor Mission

The Government of India has prioritised talent development through training, upskilling and workforce development under the Chips to Startups initiative of the India Semiconductor Mission, with officials noting progress in four years towards a 10-year target of training 85,000 engineers in semiconductor design. Electronic design automation tools provided by Synopsys, Cadence, Siemens, Renesas, Ansys and AMD have been deployed in 315 academic institutions, enabling students to gain practical chip design experience. Chips have been fabricated and tested at the Semiconductor Laboratory, Mohali, a..

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Infrastructure Urban

NHA Announces Winners Of NHCX Hackathon At IIT Hyderabad

The National Health Authority (NHA) has concluded the NHCX Hackathon under the Ayushman Bharat Digital Mission (ABDM) to stimulate innovation around the National Health Claims Exchange (NHCX). The winning teams presented their solutions at the NHCX Innovation Meet held at IIT Hyderabad during a two-day event in March 2026 that also served as the hackathon grand finale. The hackathon itself ran from 22 to 28 February 2026 and aimed to accelerate paperless, transparent claims processing across India. The event was organised with a range of ecosystem partners, including the Insurance Regulatory a..

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