izmo Microsystems Hits 3D Space-grade SiP Milestone with 84% cut

16 Jan 2026 CW Team

The newly engineered solution replaces a conventional 200 mm × 200 mm printed circuit board with a compact 81 mm × 81 mm SiP module, delivering an 84% reduction in footprint. The achievement is enabled by an advanced 3D SiP architecture that uses stacked substrates and integrates active components in bare-die form through high-density wire bonding. This design allows high routing density and multifunctional integration while meeting the stringent reliability requirements of space applications.

The module is housed in a fully indigenised custom hermetic ceramic package, designed and fabricated in India. Built to withstand extreme thermal variations and vacuum conditions, the package ensures long-term performance and environmental robustness. Managing signal integrity and thermal dissipation at such high densities within a small volume remains a key technical challenge, underscoring the complexity of the accomplishment.

The milestone aligns closely with India’s semiconductor mission and the “Make in India” initiative. Unlike conventional SiP solutions that primarily serve commercial electronics, izmo Microsystems’ work demonstrates advanced 3D heterogeneous integration tailored for space electronics—capabilities currently limited to a handful of global Tier-1 aerospace players.

By developing indigenous 3D vertical stacking and hermetically sealed ceramic packaging, the company reduces dependence on restricted foreign technologies for mission-critical systems. The platform also lays the groundwork for future applications in Silicon Photonics and Quantum Communications, where traditional packaging approaches fall short.

Dinanath Soni, Executive Director, izmo Microsystems, said, “The successful realization of this 3D SiP module validates our technical roadmap and our ability to execute on highly complex semiconductor packaging requirements. By migrating space electronics to integrated 3D architectures, we provide a viable solution for the ‘NewSpace’ industry where mass and volume reduction are critical factors. This achievement confirms our end-to-end competency in space-grade miniaturization and our commitment to building high-value intellectual property within India.”

Globally, the System-in-Package and space electronics markets—valued at over $20 billion and $10 billion respectively—are being driven by demand for heterogeneous integration across Silicon Photonics, RF and power electronics, positioning izmo Microsystems within a rapidly evolving landscape of advanced semiconductor solutions.

izmo has achieved a significant breakthrough in advanced semiconductor packaging, with its specialised arm izmo Microsystems successfully designing a high-complexity 3D System-in-Package (SiP) module for space payload camera electronics. The development marks a major step forward for space-grade electronics manufacturing in India.The newly engineered solution replaces a conventional 200 mm × 200 mm printed circuit board with a compact 81 mm × 81 mm SiP module, delivering an 84% reduction in footprint. The achievement is enabled by an advanced 3D SiP architecture that uses stacked substrates and integrates active components in bare-die form through high-density wire bonding. This design allows high routing density and multifunctional integration while meeting the stringent reliability requirements of space applications.The module is housed in a fully indigenised custom hermetic ceramic package, designed and fabricated in India. Built to withstand extreme thermal variations and vacuum conditions, the package ensures long-term performance and environmental robustness. Managing signal integrity and thermal dissipation at such high densities within a small volume remains a key technical challenge, underscoring the complexity of the accomplishment.The milestone aligns closely with India’s semiconductor mission and the “Make in India” initiative. Unlike conventional SiP solutions that primarily serve commercial electronics, izmo Microsystems’ work demonstrates advanced 3D heterogeneous integration tailored for space electronics—capabilities currently limited to a handful of global Tier-1 aerospace players.By developing indigenous 3D vertical stacking and hermetically sealed ceramic packaging, the company reduces dependence on restricted foreign technologies for mission-critical systems. The platform also lays the groundwork for future applications in Silicon Photonics and Quantum Communications, where traditional packaging approaches fall short.Dinanath Soni, Executive Director, izmo Microsystems, said, “The successful realization of this 3D SiP module validates our technical roadmap and our ability to execute on highly complex semiconductor packaging requirements. By migrating space electronics to integrated 3D architectures, we provide a viable solution for the ‘NewSpace’ industry where mass and volume reduction are critical factors. This achievement confirms our end-to-end competency in space-grade miniaturization and our commitment to building high-value intellectual property within India.”Globally, the System-in-Package and space electronics markets—valued at over $20 billion and $10 billion respectively—are being driven by demand for heterogeneous integration across Silicon Photonics, RF and power electronics, positioning izmo Microsystems within a rapidly evolving landscape of advanced semiconductor solutions.

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