Covestro Showcases AI Material Solutions at COMPUTEX

29 May 2026 CW Team

Covestro presented its high-performance and sustainable material solutions at COMPUTEX 2026 in Taipei under the theme “The Material Effect”. The company showcased how engineering plastics, polycarbonate and TPU solutions can support AI computing, embodied intelligence, robotics and connected devices.

For AI data centres, supercomputing servers and semiconductor manufacturing, Covestro’s polycarbonate solutions offer flame retardancy, thermal management, lightweight properties, dimensional stability and heat resistance. These materials are designed for applications such as power distribution, cooling systems, IT hardware, chips and wafer storage boxes.

The company also highlighted solutions for AI notebooks, gaming devices and peripherals, including carbon fibre-reinforced, glass fibre-reinforced and transparent flame-retardant polycarbonates. These materials enable lightweight, strong and premium device designs.

In embodied intelligence, Covestro’s materials support robotics applications through impact-resistant structural parts, infrared-transmitting sensor housings, rigid polycarbonate films for human-machine interaction and flexible TPU films for tactile sensing, dexterous hands and electronic skin.

Covestro is also working with partners such as Hikrobot, Carthane and Roborock to develop material solutions for logistics robots, machine vision, robot components and smart vacuum cleaners. The company further showcased sustainable options, including recycled, bio-circular attributed and NIA-PFAS materials, aimed at reducing carbon footprint while maintaining performance and design flexibility.

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