Carrier Japan’s Smart X Heat Pump Earns WIPO Green Technology Honour

21 Nov 2025 CW Team

Carrier Japan’s Universal Smart X (USX) air-cooled modular chiller and heat-pump series has been selected for inclusion in the EXPO 2025 Special Edition of the Green Technology Book, published by the World Intellectual Property Organization. The listing recognises more than 200 influential energy innovations from the Asia-Pacific region and highlights technologies contributing to a sustainable, low-carbon future. Carrier Japan forms part of Carrier Global Corporation, a global provider of climate and energy solutions.

Toru Kubo, President of Carrier Japan, said the recognition reflects the USX series’ strength as both a technological advancement and a practical response to environmental and customer needs. The company has emphasised its continued focus on purposeful innovation and energy-efficient products.

WIPO’s publication highlights climate solutions emerging from the Asia-Pacific region, the world’s fastest-growing market and home to a majority of the global population. The USX series is among Japan’s leading modular chiller and heat-pump platforms, known for its high performance and efficiency. The USX EDGE 32 previously won the top honour at the 2021 Energy Conservation Grand Prize Awards, while the space-efficient USX FIT, equipped with triplet rotary compressors and retrofit capability, earned the highest prize at the 2025 Demand Side Management Awards.

Inclusion in the Green Technology Book further strengthens the USX series’ profile and underscores Carrier Japan’s long-term commitment to advancing energy-efficient solutions and supporting global sustainability goals.

Infrastructure Urban

11 Mar 2026

India Expands Semiconductor Training To 500 Institutions

Under the Chips to Startups programme of the India Semiconductor Mission, the Union minister responsible for Railways, Information and Broadcasting, and Electronics and IT reported notable progress in talent development. He indicated that over the past four years substantial steps have been taken towards a 10-year target of training 85,000 engineers in semiconductor design. World-class EDA tools have been deployed in 315 academic institutions across the country to provide students with practical exposure to chip design. These EDA tools are supported by leading global firms and are accessible t..

Delhi Institutions Support India Semiconductor Mission

The Government of India has prioritised talent development through training, upskilling and workforce development under the Chips to Startups initiative of the India Semiconductor Mission, with officials noting progress in four years towards a 10-year target of training 85,000 engineers in semiconductor design. Electronic design automation tools provided by Synopsys, Cadence, Siemens, Renesas, Ansys and AMD have been deployed in 315 academic institutions, enabling students to gain practical chip design experience. Chips have been fabricated and tested at the Semiconductor Laboratory, Mohali, a..

NHA Announces Winners Of NHCX Hackathon At IIT Hyderabad

The National Health Authority (NHA) has concluded the NHCX Hackathon under the Ayushman Bharat Digital Mission (ABDM) to stimulate innovation around the National Health Claims Exchange (NHCX). The winning teams presented their solutions at the NHCX Innovation Meet held at IIT Hyderabad during a two-day event in March 2026 that also served as the hackathon grand finale. The hackathon itself ran from 22 to 28 February 2026 and aimed to accelerate paperless, transparent claims processing across India. The event was organised with a range of ecosystem partners, including the Insurance Regulatory a..