+
GMR Airports raises Rs 1,110 cr from JPMorgan and Morgan Stanley
AVIATION & AIRPORTS

GMR Airports raises Rs 1,110 cr from JPMorgan and Morgan Stanley

GMR Airports has raised Rs 1,110 crore from JPMorgan Securities and Morgan Stanley India Primary Dealer to make timely payments on bonds due on September 24. GMR Airports had an Rs 1,330-crore payment due on September 24 to DB International, Standard Chartered Bank and Aditya Birla Special Situation Fund. It raised two-year bonds at 12.13% through private placement of bonds on September 22 to repay the trio.

GMR Airports, which operates Delhi and Hyderabad airports, paid entire dues to DB International and Aditya Birla Capital, but part payment was made to Standard Chartered Bank. On September 22, it raised Rs 795 crore from JP Morgan Securities and Rs 315 crore from Morgan Stanley India Primary Dealer through private placement of bonds, the people said.

Financial covenants of the bond documents stipulate that the indebtedness of Delhi International Airport (DIAL) cannot exceed $1.94 billion and that of GMR Hyderabad International Airport (GHIAL) cannot exceed $1.75 billion until the new bonds are redeemed. It also stated that any new financial indebtedness should be aimed only for capital expenditure of DIAL and GHIAL.

GMR Airports has raised Rs 1,110 crore from JPMorgan Securities and Morgan Stanley India Primary Dealer to make timely payments on bonds due on September 24. GMR Airports had an Rs 1,330-crore payment due on September 24 to DB International, Standard Chartered Bank and Aditya Birla Special Situation Fund. It raised two-year bonds at 12.13% through private placement of bonds on September 22 to repay the trio. GMR Airports, which operates Delhi and Hyderabad airports, paid entire dues to DB International and Aditya Birla Capital, but part payment was made to Standard Chartered Bank. On September 22, it raised Rs 795 crore from JP Morgan Securities and Rs 315 crore from Morgan Stanley India Primary Dealer through private placement of bonds, the people said. Financial covenants of the bond documents stipulate that the indebtedness of Delhi International Airport (DIAL) cannot exceed $1.94 billion and that of GMR Hyderabad International Airport (GHIAL) cannot exceed $1.75 billion until the new bonds are redeemed. It also stated that any new financial indebtedness should be aimed only for capital expenditure of DIAL and GHIAL.

Related Stories

Gold Stories

Next Story
Infrastructure Urban

KONE Opens India's First Digital Experience Centre in Pune

KONE, a global elevator and escalator manufacturer, has inaugurated its first Digital Experience Centre (DEC) in India, located in Pune. The facility aims to showcase how artificial intelligence (AI), connectivity and data-driven technologies can enhance customer experiences and improve building operations.The centre was inaugurated by Jussi Herlin, Executive Vice Chair, KONE Corporation; Philippe Delorme, President and CEO, KONE; and Nandan Nilekani, Co-founder and Chairman of the Board, Infosys.Designed as an interactive customer environment, the facility demonstrates digital solutions cover..

Next Story
Infrastructure Urban

CII GreenCo Launches Circularity Guidelines for Indian Industry

The Confederation of Indian Industry (CII) GreenCo Council has launched the CII GreenCo Circularity Guidelines – Pilot Version at the 17th CII GreenCo Waste & Resource Management Summit 2026 in Chennai. The initiative aims to strengthen resource efficiency, waste reduction and circular economy practices across Indian manufacturing and process industries.The guidelines introduce a structured framework with circularity indices covering raw materials, consumables, packaging and other resource inputs. These indicators will help industries assess existing practices, identify opportunities to ..

Next Story
Infrastructure Energy

Global Electronics Association Launches IPC-1783-CO2E Standard

The Global Electronics Association has introduced IPC-1783-CO2E, a new international standard aimed at improving consistency, transparency and comparability in product carbon footprint reporting across the electronics manufacturing industry.The standard, titled International Standard for Data Collection and Reporting of CO2 Equivalent (CO2e) Emissions for the Electronics Manufacturing Supply Chain, provides industry-specific guidance for collecting, estimating and reporting carbon emissions data.With increasing regulatory requirements and customer expectations, electronics manufacturers face c..

Advertisement

Subscribe to Our Newsletter

Get daily newsletters around different themes from Construction world.

STAY CONNECTED

Advertisement

SPECIAL OFFER
QR Code