RVNL, NHAI sign MoU for multimodal logistics parks across India
ROADS & HIGHWAYS

RVNL, NHAI sign MoU for multimodal logistics parks across India

In connection with the construction of Multi-Modal Logistics Parks across PAN India under the Bharatmala Pariyojana, Rail Vikas Nigam Limited has signed a Memorandum of Understanding (MoU) with the National Highways Authority of India (NHAI) represented by National Highways Logistics Management (NHLML).

Given the goals of improving logistics efficiency for goods generating and aggregating from ports, the hinterland, and the country as a whole, RVNL and NHLML agreed to work together to achieve the MMLP Project's development objectives in a coordinated manner.

RVNL will be in charge of the track connectivity work for MMLPs, including design, planning, feasibility studies, DPR, implementation, and commissioning.

At the appropriate stage, separate MoUs and Agreements will be drawn up for each of the 35 MMLPs planned across the country. The concept is to form project-specific SPV(s) on a Hub and Spoke Model to provide state-of-the-art, large-scale warehousing facilities for various commodities. This umbrella Memorandum of Understanding will be valid for five years and can be extended.

Rail Vikas Nigam Limited is a subsidiary of Indian Railways, Ministry of Railways, Government of India, which is responsible for developing rail infrastructure for the railways.

Image Source


Also read: MoRTH to build 35 multi-modal logistics parks under PPP model

In connection with the construction of Multi-Modal Logistics Parks across PAN India under the Bharatmala Pariyojana, Rail Vikas Nigam Limited has signed a Memorandum of Understanding (MoU) with the National Highways Authority of India (NHAI) represented by National Highways Logistics Management (NHLML). Given the goals of improving logistics efficiency for goods generating and aggregating from ports, the hinterland, and the country as a whole, RVNL and NHLML agreed to work together to achieve the MMLP Project's development objectives in a coordinated manner. RVNL will be in charge of the track connectivity work for MMLPs, including design, planning, feasibility studies, DPR, implementation, and commissioning. At the appropriate stage, separate MoUs and Agreements will be drawn up for each of the 35 MMLPs planned across the country. The concept is to form project-specific SPV(s) on a Hub and Spoke Model to provide state-of-the-art, large-scale warehousing facilities for various commodities. This umbrella Memorandum of Understanding will be valid for five years and can be extended. Rail Vikas Nigam Limited is a subsidiary of Indian Railways, Ministry of Railways, Government of India, which is responsible for developing rail infrastructure for the railways. Image Source Also read: MoRTH to build 35 multi-modal logistics parks under PPP model

Related Stories

Gold Stories

Next Story
Infrastructure Urban

KONE Opens India's First Digital Experience Centre in Pune

KONE, a global elevator and escalator manufacturer, has inaugurated its first Digital Experience Centre (DEC) in India, located in Pune. The facility aims to showcase how artificial intelligence (AI), connectivity and data-driven technologies can enhance customer experiences and improve building operations.The centre was inaugurated by Jussi Herlin, Executive Vice Chair, KONE Corporation; Philippe Delorme, President and CEO, KONE; and Nandan Nilekani, Co-founder and Chairman of the Board, Infosys.Designed as an interactive customer environment, the facility demonstrates digital solutions cover..

Next Story
Infrastructure Urban

CII GreenCo Launches Circularity Guidelines for Indian Industry

The Confederation of Indian Industry (CII) GreenCo Council has launched the CII GreenCo Circularity Guidelines – Pilot Version at the 17th CII GreenCo Waste & Resource Management Summit 2026 in Chennai. The initiative aims to strengthen resource efficiency, waste reduction and circular economy practices across Indian manufacturing and process industries.The guidelines introduce a structured framework with circularity indices covering raw materials, consumables, packaging and other resource inputs. These indicators will help industries assess existing practices, identify opportunities to ..

Next Story
Infrastructure Energy

Global Electronics Association Launches IPC-1783-CO2E Standard

The Global Electronics Association has introduced IPC-1783-CO2E, a new international standard aimed at improving consistency, transparency and comparability in product carbon footprint reporting across the electronics manufacturing industry.The standard, titled International Standard for Data Collection and Reporting of CO2 Equivalent (CO2e) Emissions for the Electronics Manufacturing Supply Chain, provides industry-specific guidance for collecting, estimating and reporting carbon emissions data.With increasing regulatory requirements and customer expectations, electronics manufacturers face c..

Advertisement

Subscribe to Our Newsletter

Get daily newsletters around different themes from Construction world.

STAY CONNECTED

Advertisement

SPECIAL OFFER
QR Code