An MoU has been signed to bring substrate manufacturing technology to India, witnessed by the Union Minister for Electronics and Information Technology Ashwini Vaishnaw, the Chief Minister of Odisha Mohan Charan Majhi and the Chief Executive Officer of Intel Lip-Bu Tan. The agreement was executed between the Government of Odisha, Intel Corporation (Intel) and 3DGS Inc. USA (3DGS) to frame the establishment of an Advanced Packaging Glass Core Substrate Manufacturing Facility in the Bhubaneswar–Khurda region. The project is described as one of the largest high-technology manufacturing investments in India and is intended to anchor advanced packaging capabilities domestically. The minister indicated that the MoU aligns with the Government's vision of developing the entire semiconductor manufacturing ecosystem in India and welcomed participation of multiple global suppliers as affirmation of policy measures. He referenced the entry of firms such as Applied Materials Inc., Lam Research, Tokyo Electron Ltd., Merck Electronics and the memorandum between Tata Electronics and ASML as examples of industry trust. The agreement is presented as recognition of government efforts and a step towards integrated manufacturing, design and supply chain development. The project will be implemented in phases over a period of five to six years and is expected to generate direct high-skilled employment while creating substantial indirect employment across the broader manufacturing and technology ecosystem. The facility will focus on advanced packaging glass core substrates, high-density interconnect substrates and associated semiconductor process technologies, with Intel supporting technology know-how and process expertise. Observers expect the initiative to advance capability development and foster export-oriented manufacturing, reinforcing domestic supply chain resilience. The initiative builds on ongoing measures under the India Semiconductor Mission (ISM) to strengthen domestic manufacturing, design ecosystem and supply chain capabilities and seeks to position Odisha among emerging global centres for semiconductor manufacturing and digital infrastructure. The partners intend the facility to complement national efforts to attract high-technology investments and to catalyse ancillary industries in the region. Further implementation details, including timelines for each phase and investment quantum, will be developed by the parties as the framework advances.