PM to Join Groundbreaking of HCL-Foxconn Chip Facility
ECONOMY & POLICY

PM to Join Groundbreaking of HCL-Foxconn Chip Facility

The Prime Minister will participate in the groundbreaking ceremony of the HCL-Foxconn joint venture project, India Chip Pvt. Ltd., at the Yamuna Expressway Industrial Development Authority in Uttar Pradesh on 21 February 2026 and will address the gathering around five pm via video conferencing. The participation is expected to mark the formal commencement of construction activities at the site. The event will be held under the auspices of the Prime Minister's Office.

The facility will be established as an Outsourced Semiconductor Assembly and Test facility by India Chip Pvt. Ltd. under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging. The project has been described as a significant milestone in the national drive for technological self-reliance and in efforts to develop high-end electronics and semiconductor manufacturing. The site selection at YEIDA is intended to leverage regional infrastructure and create a cluster for electronics production.

The investment for the scheme totals more than Rs 37 billion (bn), converted from the original Rs 3,700 crore figure, and is intended to strengthen domestic manufacturing capabilities and reduce import dependence. The project is expected to support key sectors such as mobile phones, tablets, laptops, automotive systems and consumer electronics, thereby contributing to the resilience of global supply chains. It has been presented as aligned with government policy to encourage technology transfer and enhance competitiveness in the semiconductor value chain.

The initiative is expected to foster innovation, skill development and the transfer of manufacturing expertise, and to catalyse growth in ancillary industries. The facility is likely to generate thousands of direct and indirect employment opportunities for engineers, technicians and other professionals. Stakeholders have indicated that the joint venture will contribute to building a robust and self-reliant electronics manufacturing ecosystem and to elevating India’s stature in the global semiconductor landscape.

The Prime Minister will participate in the groundbreaking ceremony of the HCL-Foxconn joint venture project, India Chip Pvt. Ltd., at the Yamuna Expressway Industrial Development Authority in Uttar Pradesh on 21 February 2026 and will address the gathering around five pm via video conferencing. The participation is expected to mark the formal commencement of construction activities at the site. The event will be held under the auspices of the Prime Minister's Office. The facility will be established as an Outsourced Semiconductor Assembly and Test facility by India Chip Pvt. Ltd. under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging. The project has been described as a significant milestone in the national drive for technological self-reliance and in efforts to develop high-end electronics and semiconductor manufacturing. The site selection at YEIDA is intended to leverage regional infrastructure and create a cluster for electronics production. The investment for the scheme totals more than Rs 37 billion (bn), converted from the original Rs 3,700 crore figure, and is intended to strengthen domestic manufacturing capabilities and reduce import dependence. The project is expected to support key sectors such as mobile phones, tablets, laptops, automotive systems and consumer electronics, thereby contributing to the resilience of global supply chains. It has been presented as aligned with government policy to encourage technology transfer and enhance competitiveness in the semiconductor value chain. The initiative is expected to foster innovation, skill development and the transfer of manufacturing expertise, and to catalyse growth in ancillary industries. The facility is likely to generate thousands of direct and indirect employment opportunities for engineers, technicians and other professionals. Stakeholders have indicated that the joint venture will contribute to building a robust and self-reliant electronics manufacturing ecosystem and to elevating India’s stature in the global semiconductor landscape.

Related Stories

Gold Stories

Next Story
Products

Koemmerling opens Navi Mumbai experience centre

Koemmerling, a brand of the profine Group, has expanded its presence in the Mumbai metropolitan region with the opening of a new experience centre in Navi Mumbai and launched its Allure S46 minimal sliding door system for the Indian market.Located in CBD Belapur, the facility was inaugurated by Peter Mrosik, Owner and CEO, profine Group, along with Farid Khan, Chairman and Managing Director, profine India, and Kamal Bajaj, CEO, profine India.The company said the new centre will showcase its portfolio of uPVC and aluminium window and door systems to architects, developers and homeowners.The ina..

Next Story
Products

India's waterproofing market nears Rs 150 bn milestone

India's waterproofing industry is approaching a market size of Rs 150 billion and is expected to surpass the $2 billion milestone, according to speakers at the 2nd India International Waterproofers Conference & Expo 2026 organised by the Waterproofers Association of India (WAI) in New Delhi.The two-day event brought together more than 20 speakers, 55 international delegates and 53 exhibition booths, with discussions focusing on climate-resilient construction, advanced waterproofing technologies and international collaboration.Inaugurating the event, Durga Shanker Mishra, former Secretary, ..

Next Story
Real Estate

Dilip Buildcon Q1 FY27 Revenue at Rs 23.78 billion

Dilip Buildcon Limited reported consolidated revenue from operations of Rs 2,378 crore in Q1 FY27, along with EBITDA of Rs 429 crore and profit after tax of Rs 128 crore.Consolidated EBITDA margin stood at 18.1%, improving from 17.1% in Q4 FY26. On a standalone basis, revenue from operations was Rs 1,930 crore, EBITDA stood at Rs 199 crore and PAT was Rs 39 crore, with an EBITDA margin of 10.3%.The company’s order book stood at Rs 27,691 crore as of 30 June 2026, compared with Rs 28,830 crore as of 31 March 2026. Roads and highways accounted for 17.1% of the order book, irrigation and water ..

Advertisement

Subscribe to Our Newsletter

Get daily newsletters around different themes from Construction world.

STAY CONNECTED

Advertisement