Raneal Expands Oversized Printed Circuit Board Assembly Capacity

10 Mar 2026 CW Team

The upgraded line can accommodate PCBs exceeding conventional size limitations, including assemblies up to 55 inches in length, and targets applications in defence and aerospace as well as industrial electronics and advanced power systems. The capability includes mission-critical backplane assemblies and integrates advanced surface mount technology and through-hole processes. Material handling and board support systems have been reinforced and process control has been improved to address the challenges of large-format assemblies. Testing and validation infrastructure has been strengthened to ensure thorough inspection and validation of large assemblies prior to delivery.

The expansion is expected to optimise workflow within the existing facility and to improve operational efficiency without compromising quality, reliability or turnaround time. The company indicated that it has already secured orders worth Rs 200 million (mn) for oversized PCB assembly, demonstrating early commercial traction. The move forms part of DCX's wider strategy of capability enhancement, technological innovation and customer-centric manufacturing.

Operating from the Hi-Tech Defence and Aerospace Park special economic zone in Bengaluru, DCX Systems Limited is positioned to support both domestic and international defence and aerospace programmes. The company emphasised continued focus on Make-in-India initiatives and on partnerships with global original equipment manufacturers to deepen its role in supply chains and offset programmes. The expansion reinforces the company's commitment to precision engineered electronic manufacturing solutions.

DCX Systems Limited (DCX) has announced an expansion of manufacturing capabilities through its wholly owned subsidiary Raneal Advanced Systems Pvt. Ltd. (Raneal). The development, disclosed on three March 2026, adds oversized Printed Circuit Board (PCB) assembly capacity at the company facility in Bengaluru. The enhancement is designed to strengthen support for complex large-format requirements across high-reliability industries. The upgraded line can accommodate PCBs exceeding conventional size limitations, including assemblies up to 55 inches in length, and targets applications in defence and aerospace as well as industrial electronics and advanced power systems. The capability includes mission-critical backplane assemblies and integrates advanced surface mount technology and through-hole processes. Material handling and board support systems have been reinforced and process control has been improved to address the challenges of large-format assemblies. Testing and validation infrastructure has been strengthened to ensure thorough inspection and validation of large assemblies prior to delivery. The expansion is expected to optimise workflow within the existing facility and to improve operational efficiency without compromising quality, reliability or turnaround time. The company indicated that it has already secured orders worth Rs 200 million (mn) for oversized PCB assembly, demonstrating early commercial traction. The move forms part of DCX's wider strategy of capability enhancement, technological innovation and customer-centric manufacturing. Operating from the Hi-Tech Defence and Aerospace Park special economic zone in Bengaluru, DCX Systems Limited is positioned to support both domestic and international defence and aerospace programmes. The company emphasised continued focus on Make-in-India initiatives and on partnerships with global original equipment manufacturers to deepen its role in supply chains and offset programmes. The expansion reinforces the company's commitment to precision engineered electronic manufacturing solutions.

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