Izmomicro Partners With CCRAFT and Alcyon to Advance Silicon Photonics

17 Mar 2026 CW Team

CCRAFT operates an ISO-certified 150 mm wafer foundry and is one of a small cohort of companies globally manufacturing TFLN photonic chips at scale, enabling electro-optic modulators exceeding 400 Gbit/s. Alcyon Photonics supplies validated, fabrication-ready photonic intellectual property libraries that accelerate transition from prototype to volume production. Together the two European partners bring foundry capacity and design IP to complement packaging capabilities.

izmomicro brings advanced semiconductor packaging and co-packaged optics expertise that covers design, simulation, optical alignment, fibre attach, hermetic sealing and system-level testing, with operations in a Class 1000 cleanroom in Bangalore. The company has demonstrated end-to-end silicon photonics packaging capability and offers three dimensional die stacking, flip-chip assembly and fine-pitch wire bonding to translate chip designs into production-ready systems. The packaging infrastructure is presented as a scarce global resource that can position India as a credible participant in the silicon photonics supply chain.

The partners will collaborate to deliver Alcyon Photonics' IP libraries to customers, undertake joint design and production of photonic systems and commercialise jointly developed solutions with izmomicro designated as preferred packaging partner. Industry research is cited that valued the global silicon photonics market at about USD 2–3 billion in 2025 and projected growth at 25–30 per cent CAGR, with addressable markets in the early 2030s of USD 10–22 billion and potential to exceed USD 28 billion by 2034. The collaboration is framed as an India-Europe technology bridge aligned with national semiconductor initiatives and European strategic priorities.

izmo Microsystems Private Limited (izmomicro), the semiconductor division of NSE-listed izmo Limited, has signed a memorandum of understanding (MoU) with CCRAFT SA (CCRAFT), a Swiss thin-film lithium niobate (TFLN) photonic chip foundry, and Alcyon Photonics SL (Alcyon Photonics) of Spain to jointly design, produce and commercialise advanced photonic integrated circuit (PIC) solutions for datacom, telecom, aerospace and sensor markets. The three-party collaboration establishes a framework for joint design, production and commercial deployment of photonic systems. The agreement positions the partners to address demand for high-speed electro-optic modulation and integrated photonics subsystems. CCRAFT operates an ISO-certified 150 mm wafer foundry and is one of a small cohort of companies globally manufacturing TFLN photonic chips at scale, enabling electro-optic modulators exceeding 400 Gbit/s. Alcyon Photonics supplies validated, fabrication-ready photonic intellectual property libraries that accelerate transition from prototype to volume production. Together the two European partners bring foundry capacity and design IP to complement packaging capabilities. izmomicro brings advanced semiconductor packaging and co-packaged optics expertise that covers design, simulation, optical alignment, fibre attach, hermetic sealing and system-level testing, with operations in a Class 1000 cleanroom in Bangalore. The company has demonstrated end-to-end silicon photonics packaging capability and offers three dimensional die stacking, flip-chip assembly and fine-pitch wire bonding to translate chip designs into production-ready systems. The packaging infrastructure is presented as a scarce global resource that can position India as a credible participant in the silicon photonics supply chain. The partners will collaborate to deliver Alcyon Photonics' IP libraries to customers, undertake joint design and production of photonic systems and commercialise jointly developed solutions with izmomicro designated as preferred packaging partner. Industry research is cited that valued the global silicon photonics market at about USD 2–3 billion in 2025 and projected growth at 25–30 per cent CAGR, with addressable markets in the early 2030s of USD 10–22 billion and potential to exceed USD 28 billion by 2034. The collaboration is framed as an India-Europe technology bridge aligned with national semiconductor initiatives and European strategic priorities.

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