Sasken Launches Hyderabad Centre Of Excellence For Product Engineering

21 Apr 2026 CW Team

It will focus on next generation engineering across connected devices, five G-led platforms, Internet of Things solutions, embedded systems and digital product engineering to support Automotive, Smart devices, HiTech, Satellite communication and Industrial programmes. The centre is designed to enable faster product innovation and reduce time to market for customers working on complex global programmes. Work will span advanced engineering for semiconductors, original design manufacturers and intelligent platforms to address evolving system level challenges.

Sasken appointed Nirmala Datla, Chief Data Science and Engineering Officer, as site leader for the Hyderabad centre to drive delivery excellence and build next generation engineering capabilities. She will lead talent development efforts from the location and oversee programmes across connected devices and intelligent platforms. The company plans to hire initially 100+ specialised engineering professionals from Hyderabad’s technology talent ecosystem over the coming months.

Senior management said the Hyderabad centre represents a strategic investment to meet growing demand for product engineering and digital transformation services and to enable closer customer collaboration. Management noted that the location offers an excellent talent pool across business units and will support scaling with greater speed, scale and proximity to customers. The group reiterated its focus on focused investments in talent and capabilities to support targeted segments and sustain growth.

Sasken Technologies Limited (Sasken) has opened a new Centre of Excellence in Hyderabad to scale product engineering and digital innovation for global customers. The company said the facility will strengthen its regional delivery footprint and deepen collaboration with strategic chipset customers such as Qualcomm and their original equipment manufacturers. The Hyderabad centre is located within one of India’s fastest growing technology ecosystems and is intended to enable closer customer collaboration and accelerate engineering cycles for complex programmes. It will focus on next generation engineering across connected devices, five G-led platforms, Internet of Things solutions, embedded systems and digital product engineering to support Automotive, Smart devices, HiTech, Satellite communication and Industrial programmes. The centre is designed to enable faster product innovation and reduce time to market for customers working on complex global programmes. Work will span advanced engineering for semiconductors, original design manufacturers and intelligent platforms to address evolving system level challenges. Sasken appointed Nirmala Datla, Chief Data Science and Engineering Officer, as site leader for the Hyderabad centre to drive delivery excellence and build next generation engineering capabilities. She will lead talent development efforts from the location and oversee programmes across connected devices and intelligent platforms. The company plans to hire initially 100+ specialised engineering professionals from Hyderabad’s technology talent ecosystem over the coming months. Senior management said the Hyderabad centre represents a strategic investment to meet growing demand for product engineering and digital transformation services and to enable closer customer collaboration. Management noted that the location offers an excellent talent pool across business units and will support scaling with greater speed, scale and proximity to customers. The group reiterated its focus on focused investments in talent and capabilities to support targeted segments and sustain growth.

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